908-35-1-12-2-B-0 -

Heatsink; Eliptical Pin with clip assembly; 35 x 11.6 mm

聲明：圖片僅供參考，請(qǐng)以實(shí)物為準(zhǔn)！

制造商：: Wakefield Wakefield
制造商產(chǎn)品編號(hào)：: 908-35-1-12-2-B-0
倉(cāng)庫(kù)庫(kù)存編號(hào)：: 70357151
技術(shù)數(shù)據(jù)表：: Datasheet

訂購(gòu)熱線： 400-900-3095 0755-21000796, QQ:800152669, Email:sales@szcwdz.com

由于產(chǎn)品數(shù)據(jù)庫(kù)龐大，部分產(chǎn)品信息可能未能及時(shí)更新，下單前請(qǐng)與銷售人員確認(rèn)好實(shí)時(shí)在庫(kù)數(shù)量，謝謝合作！

908-35-1-12-2-B-0產(chǎn)品概述

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

908-35-1-12-2-B-0產(chǎn)品信息

908-35-1-12-2-B-0相關(guān)搜索

Brand/Series 908 Series Wakefield Brand/Series 908 Series Heatsinks Brand/Series 908 Series Wakefield Heatsinks Brand/Series 908 Series Dimensions 35 x 11.6 mm Wakefield Dimensions 35 x 11.6 mm Heatsinks Dimensions 35 x 11.6 mm Wakefield Heatsinks Dimensions 35 x 11.6 mm Finish Black Anodized Wakefield Finish Black Anodized Heatsinks Finish Black Anodized Wakefield Heatsinks Finish Black Anodized For Use With BGA Wakefield For Use With BGA Heatsinks For Use With BGA Wakefield Heatsinks For Use With BGA Material Aluminum Wakefield Material Aluminum Heatsinks Material Aluminum Wakefield Heatsinks Material Aluminum Thermal Resistance 3.1 °C/W Wakefield Thermal Resistance 3.1 °C/W Heatsinks Thermal Resistance 3.1 °C/W Wakefield Heatsinks Thermal Resistance 3.1 °C/W

郵箱：sales@szcwdz.com
Q Q：800152669
手機(jī)網(wǎng)站：m.szcwdz.com

美國(guó)1號(hào)品牌選型新加坡2號(hào)品牌選型

英國(guó)2號(hào)品牌選型英國(guó)10號(hào)品牌選型

日本5號(hào)品牌選型

Brand/Series	908 Series
Dimensions	35 x 11.6 mm
Finish	Black Anodized
For Use With	BGA
Material	Aluminum
Thermal Resistance	3.1 °C/W
關(guān)鍵詞