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907-33-1-18-2-B-0 - 

Heatsink; Eliptical Pin with clip assembly; 33 x 17.6 mm

Wakefield 907-33-1-18-2-B-0
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制造商產(chǎn)品編號(hào):
907-33-1-18-2-B-0
倉庫庫存編號(hào):
70357146
技術(shù)數(shù)據(jù)表:
View 907-33-1-18-2-B-0 Datasheet Datasheet
訂購熱線: 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
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907-33-1-18-2-B-0產(chǎn)品概述

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

907-33-1-18-2-B-0產(chǎn)品信息

  Brand/Series  907 Series  
  Dimensions  33 x 17.6 mm  
  Finish  Black Anodized  
  For Use With  BGA  
  Material  Aluminum  
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