609-50AB產(chǎn)品概述
A general-purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in width, accommodating many types of packages. Mounting hole pattern A is predrilled for the standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
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