Contact Mating Area Plating | Gold | |
Contact Plating | Gold over Nickel | |
Contact Resistance | 25 mΩ | |
For Use With | Wire to Board | |
Material, Contact | Phosphor Bronze | |
Temperature, Operating, Maximum | 105 °C | |
Temperature, Operating, Minimum | -55 °C | |
Temperature, Operating, Range | -55 to +105 °C | |
Termination | Crimp | |
Wire Size | 26-22 | |
關鍵詞 |