3-822516-2產品概述
SMT PLCC Sockets for J-leaded Packages
Low profile SMT PLCC sockets for with a 1.27mm centerline surface mounting designed to accommodate Plastic "J" leaded, tin plated devices made to JEDEC Specifications MS-018 (square packages) and MS-016-AE (rectangular packages). These low profile PLCC sockets have a 4.60mm above board height and are suitable for high density PCB stacking. The polyphenylene sulfide thermoplastic housings of these PLCC sockets can withstand high temperature soldering. Housing slots on these PLCC sockets enable an extraction tool to be used and top contact slots allow test probing with the PLCC device in place.
Datasheet
