4900P-25G -
Solder Paste, SAC305, 96.6% tin, 0.7% copper, 3% Silver, LEAD FREE, No Clean
聲明：圖片僅供參考，請(qǐng)以實(shí)物為準(zhǔn)！
- 制造商產(chǎn)品編號(hào)：
- 4900P-25G
- 倉(cāng)庫(kù)庫(kù)存編號(hào)：
- 70377411
由于產(chǎn)品數(shù)據(jù)庫(kù)龐大，部分產(chǎn)品信息可能未能及時(shí)更新，下單前請(qǐng)與銷(xiāo)售人員確認(rèn)好實(shí)時(shí)在庫(kù)數(shù)量，謝謝合作！
4900P-25G產(chǎn)品概述
MG 4900P Lead Free Solder Paste
MG Chemicals has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Lead Free Solder paste will provide excellent cost savings. MG 4900P Lead Free solder paste exhibits superior joint strength, excellent wettability and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive and highly insulated.
Datasheet
