EXP-300產品概述
The Global Specialties EXP-300 Experimentor Series solderless breadboard has 550 tie point and offers unlimited circuit design expansion though it unique molded-in interlocking edge rails. The EXP-300 utilizes 0.3" DIP spacing, and unique molded-in mounting holes allow for either front or rear mounting. Molded interlocking edge rails on all four sides permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The integrated bus strips allow for fast connections to power and signal lines. The EXP-300 is made from durable polystyrene and premium nickel silver contacts. The EXP-300 has a heavy-duty Mylar backing to prevent short circuits.
Features
Unlimited expansion
Heavy-duty Mylar back prevents shorting
Combines bus strip with breadboard
0.3 inch/0.6 inch center channels
Replaceable nickel-silver spring clip contacts
Accepts all components with leads up to .033 inches
Combines additional boards for larger breadboarding areas
Molded-in mounting holes permit front mounting to backplate or other surface with 4-40 flat head screws — rear mounting with #6-32F self-tapping screws
