4951G產(chǎn)品概述
Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and brass, making it particularly well-suited for thermally bonding semiconductors and other components to chassis or heat sinks.