161000F00000G - 

Ther-O-Bond 1600 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic (smooth paste) thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. Blue in color, this two-part adhesive develops strong, durable, high impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. Ther-O-Bond 1600 bonds readily to itself, to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range.